TI移动无线LAN解决方案 -

Mobile Wireless LAN: WiLink 4.0 mWLAN Solutions



WiLink TM 4.0 mWLAN Solutions (WL1251/WL1253) - Availability Disclaimer

Texas Instruments (TIs) WiLink mobile Wireless LAN (mWLAN) platform includes single-chip solutions to drive Voice over WLAN (VoWLAN) into mainstream mobile phones. Based on TIs DRP technology, the WiLink 4.0 mWLAN platform is comprised of hardware and software optimized for handsets, and provides consumers with on-the-go voice access over any WLAN network.

The included WiLink Software Development Kit (SDK) 4.X is optimized for embedded applications. This includes support for Linux, Windows® WinCE, Symbian operating systems, as well as lab testing and manufacturing software. It is partitioned to minimize host CPU loading and power consumption in mobile applications.

TIs WiLink 4.0 mWLAN platform offers two different hardware single-chip implementations to provide flexibility for OEMs to offer IEEE 802.11b/g or IEEE 802.11a/b/g operation.



Get Started Now: Download the following documents for more information:

WiLink 4.0 mWLAN Product Bulletin (WL1251/WL1253) (wl1251_1253_prod_bulletin.pdf, 140 KB)
2005 Download

WiLink 4.0 mWLAN (WL1251 and WL1253) Single-Chip Solutions

Complete WLAN hardware and software solutions optimized for mobile IEEE 802.11b/g and IEEE 802.11a/b/g applications

The integrated Media Access Controller/Baseband/RF transceiver) reduces BOM costs, saves PCB space and extends standby and talk times

Market-leading physical size (6 mm x 6 mm BGA)

Support for Voice over WLAN (VoWLAN)

UMA (Unlicensed Mobile Access) technology

VoIP over WLAN

Quality of service, WPA, WPA2, CCX2.0, 3.0 and 4.0 for application specific devices

Advanced roaming support enabling rapid migration between access points and between WLAN and cellular subsystems

Industrys lowest power consumption with TIs Enhanced Low Power (ELP) technology

Bluetooth coexistence technology ensures high quality of service during simultaneous voice and data WLAN and Bluetooth operations

本文引用地址: http://www.21ic.com/app/eda/201807/798515.htm