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高通平台手机PCB设计常用英文 -

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[导读]BCCP:Bump chip carrier package CAD:Computer aided design CP:Charge pump DCN:Document control number GPS:Global positioning system LNA:Low noise amplifier mil:0.001 inch (0.0254 mm) MSM⑩:Mobil

BCCP:Bump chip carrier package CAD:Computer aided design CP:Charge pump DCN:Document control number GPS:Global positioning system LNA:Low noise amplifier mil:0.001 inch (0.0254 mm) MSM⑩:Mobile Station Modem⑩ PA:Power amplifier PCB:Printed circuit board PLL:Phase-locked loop PM:Power management QCT:QUALCOMM CDMA Technologies Division QFN:Quad flat no-lead package RFL:Radio frequency LNA RFR:Radio frequency receiver RFT:Radio frequency transmitter SBI:Serial bus interface VCO:Voltage-controlled oscillator VCTCXO:Voltage-controlled temperature-compensated crystal oscillator. Referred to as TCXO in this document. Zero-IF:A radio architecture that converts received signals directly from RF to baseband, thereby eliminating the intermediate frequency necessary in super-heterodyne receivers. The transmit signals likewise eliminate the Tx IF, upconverting directly from baseband to RF. ZIF:Zero-IF

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